Career opportunities

1. Prepare the test specification template writing specification, prepare the test specification according to the first version of the test plan of the design engineer, complete the test specification according to the actual test after the product development, record the product test process

1. Apply for manage BD drawings;

2. Be responsible for packaging uation of new products, BOM ion, packaging plant ion;

3. Be responsible for frame design order, follow up frame delivery date, output manage 3D POD drawings;

1. Participate in the design uation of the new project bumping scheme;

2. Be responsible for the ion of bumping BOM the ion of OEM;

3. Be responsible for the ordering of bumping mask, delivery time follow-up system project return;

1. Assist in new product definition, product specification writing chip system architecture design;

2. Be responsible for the circuit design simulation of the top layer of the chip the module to ensure that the chip is streamed on time;

1. Monitor the production quality of the outsourcing factory, promote the improvement perfection of its quality management system management process;

2. Formulate implement the audit plan of outsourcing manufacturers, identify systematic problems, promote improvement;

1. Advanced product quality planning, early risk identification assessment;

2. Track the quality of the whole process from product definition to RTP, as well as the implementation prevention of Lesson Learning;